Mijing Z20 4 in 1 BGA reballing platform is suitable for iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max middle layer motherboard. Mijing Z20 middle layer planted tin steel mesh platform is suitable for iPhone 13 series. MJ Professional BGA Reballing Stencil Platform Jig Fixure for iPhone.
MiJing Z20 4 in 1 BGA Reballing Stencil Platform Jig Fixure is professional BGA Reballing Stencil Fixture for iPhone 13, iPhone 13 motherboard BGA reballing fixture tool, is used for positioning and reballing iPhone 13 PCB BGA parts, convenient and faster for reballing BGA without any damage, offer you best solution for iPhone 13 BGA reballing and repairing.
1. Install the iPhone 13 main board on the platform
2. Cover the iPhone 13 BGA reballing stencil on mainboard
3. Evenly spread tin on the cover of the reballing stencil
4. Remove the reballing stencil cover
5. Take out the motherboard and cooperate with the hot air gun to solidify the tin point.