MaAnt high thermal silicone paste DR-4 DR-6 DR-8 for phone/tablet/PC IC Chip CPU GPU VGA RAM LED IC cooler LED radiator cooling, elastic bonding, heat dissipation, insulation, packaging of electronics, instruments, LEDs heat sinks, etc. 30g Thermal pads conductive heatsink insulative plaster viscous adhesive.
KS101:
It has good conductivity, wide operating temperature range (-60~200°C), and short-term resistance to 300°C.
It has high strength and fast bonding effect, and is suitable for directly attaching various components, LEDs and heat sinks.
Good thermal conductivity, strong adhesion, vacuum packaging is not easy to oxidize and dry, good viscosity, short drying time.
It has short surface curing time, long storage period, non-toxic, solvent-free, and can be safely applied to elastic bonding, heat dissipation, insulation and packaging of electronics, instruments, LEDs, heat sinks, etc.
Instructions:
Extrusion of the product directly during use, rubbing the surface of the adherend, and immediately covering it after use, in case of trial again.
The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa.
Recommended thickness: 0.1-0.5mm, the thinner the better.
Please use solvent to clean the surface of the bonded object before use （such as alcohol）, avoid cleaning with detergent, and apply it after the surface is clean.
The package is sealed and the product is covered with a vacuum bag to insulate the air and increase the storage time.
DR-4/DR-6/DR-8 Thermal Silicone Paste:
High-temperature resistance without curing.
Strong thermal conductivity, good insulation, aging resistance, rapid reduction of CPU, and so on Temperature of thermal components.
CPU companion heat balm, thermal conductivity: 4W/mk, 6W/mk, 8.5W/mk; High thermal conductivity, insulation and high temperature resistance.
It completes the heat transfer of various uneven gaps and makes up for the thermal conductive silicone sheet and insufficient thermal grease.
Ant Xin CPU companion heat sink has good high and low-temperature resistance (temperature range -60℃~200℃) and has the characteristics of non-solid and non-powdered silica gel, good thermal conductivity.
High thermal conductivity, low thermal resistance, good wettability, soft, stress-free and can be compressed to as thin as 0.1mm, can fill any uneven gap, no settlement, no flow, no oil, safe non-conducting.
Ant Xin CPU companion heat sink applied better thermal conductivity materials, so that it has high Insulation without corrosion and other better performance, so as to protect electronic components, high-power LED lights motherboard, and other service life.
Package includes:
1 x Thermal Paste
