AMAOE BCM Bluetooth WiFi IC Reballing Stencil 0.12mm

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VIPProgrammerSKU: XZ2630

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Description

Amaoe BCM Bluetooth WiFi IC Universal Reballing Stencil with Universal Position 0.4 18x18 for BCM Wifi IC Module Reballing. AMAOE BGA Module Broadcom WiFi IC 0.12mm Integrated Universal BGA Reballing Module. Amaoe BCM Bluetooth WiFi IC Universal Ball Planting Steel Mesh 0.12mm Steel Mesh BCME.


Features:
1. AMAOE BCM:1 stencil: for BCM WIFI IC 4330 4334 43340/43341 4339 43438 34355 4354/4356 4343 4774 4773 43596 0.4x18x18. 
2. The 0.12mm reballing module can basically meet the most part of BCM WiFi ic reballing in the market.
3. Commonly used BCM WiFi chip IC 11 positions, add a universal stencil with 0.4 space 18×18.


Package Includes:
1 x Stencil.

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