Qianli iAtlas 24K explosion proof gold-plated foil gasket easy to tin in for reballing precise BGA motherboard repair spacer. Qianli iAtlas 24K gold-plated foil gasket 0.8mm 0.1mm 0.12mm for mobile phone motherboard middle frame solder explosion-proof. Qianli 24K gold-plated foil for iPhone motherboard middle layer frame chips tin planting reballing.
1. Support middle frame, chips, and BGA.
2. Clamp the foil as easy as falling off a log.
3. The backbone of the precise electronics hardware.
4. Small size and great efficiency, solder explosion-proof.
5. Applied to all electronic components required lamination.
6. More stable alignment, motherboard slight deformation worry-free.
7. 3 kinds of sizes meet various needs with different thicknesses and weights.
How to use:
Efficiency, success rate Only 4 simple steps to complete the implantation of the gasket.
Step 1: Filling with tin stencil.
Step 2: Use tweezers to remove the spacer.
Step 3: Place the Pad on the Pad Paste.
Step 4: Melt the tin paste on the pad to fix the gasket and use it.
Wide range of use:
The middle frame, chip, BGA, and electronic components that need to be attached can all be used.
0.08mm *1 bottles
0.1mm *1 bottles
0.12mm *1 bottles